The active diameter is 12μm, with an integrated lens on the back, featuring high multiplication, low capacitance, low temperature coefficient, GS structure, opposite electrodes.
It can be used in 25G PON, 5G Wireless and 100G ER4.
The active diameter is 36μm, featuring high reponsivity, low dark current and gold-coated ground surface at the bottom side of chip.
It can be used in 10G PON(XGS OLT/10G EPON OLT)Class C+.
The active area is round with diameter of 50μm, featuring high reponsivity, low dark current and gold-coated ground surface at the bottom side of chip.
It can be used in 10G PON ONU.
The active diameter is 50μm, featuring high reponsivity, low dark current and gold-coated ground surface at the bottom side of chip.
It can be used in GPON ONU and 2.5G optical modules.
The active diameter is 12μm, with an integrated lens on the back, featuring high reponsivity, low dark current, GSG structure, coplanar electrodes.
It can be used in 800G and 1.6T Ethernet.
The active diameter is 12μm, with an integrated lens on the back, featuring high reponsivity, low dark current, GSG structure, coplanar electrodes and pitch size is 750um.
It can be used in 800G and 1.6T Ethernet.
The active diameter is 20μm, featuring high reponsivity, low dark current, GSG structure and coplanar electrodes.
It can be used in Data Center, 200G LR4 and 400G LR4.
The active diameter is 20μm, featuring high reponsivity, low dark current, GSG structure, coplanar electrodes and pitch size is 250um.
It can be used in Data Center, 200G LR4 and 400G LR4.