Guangte Technology is dedicated to the R&D and manufacturing of high-end photonic chips, and has built a profound moat of core technologies in the field of optical receiver chips. The company holds a number of world-leading patented technologies, with its product performance and parameters reaching the world-class level.

1. Ultra-high Speed PIN Photodetector (PD) Technology

To address the demands of AI computing power and 800G/1.6T high-speed interconnections, Guangte Technology has launched a new generation of back-illuminated 200G PIN photodetectors. Under a bias voltage of -2V, the chip boasts a bandwidth as high as 52GHz, making it perfectly compatible with the PAM4 modulation format. It achieves a responsivity of 0.7 A/W at the 1310nm communication band, which effectively enhances receiving sensitivity. By optimizing the semiconductor material and structural design, the dark current is reduced to a mere 0.35nA, and the device capacitance is only 27fF, greatly improving the system signal-to-noise ratio and ensuring the complete transmission of high-frequency signals. At present, the annual shipment volume of the company's PIN-PD chips has exceeded 10 million units.

2. High-Sensitivity APD Chip Technology

Guangte Technology’s APD products have achieved outstanding performance in the LiDAR market. The company’s proprietary large photosensitive area APD chip was awarded the Golden Light Award by China Laser. The company holds a significant competitive edge in the 200–500 meter detection range, with excellent image resolution and signal-to-noise ratio (SNR). In addition to single-channel APDs, the shipment volume of array APDs has seen a substantial growth trend. Our products feature high consistency and high resolution. At present, the annual shipment volume of APD chips is approximately 3 million units. The 50G APD is expected to achieve mass production and shipment in the optical communication field in 2026. The company has obtained the IATF16949:2016 automotive-grade quality management system certification, laying a solid foundation for expanding into the automotive LiDAR market.

3. Silicon Photonic Integrated Circuit (PIC) Technology

Guangte Technology has mastered the core processes of silicon photonic integration. The multi-channel silicon photonic integrated transceivers (100G/200G/400G RX/TX chips) developed by the company match or even outperform similar products from Europe and the United States in terms of transmission speed and sensitivity. The company has made significant progress in silicon photonic technology: the test results of 800G/1.6T silicon photonic chips are favorable, and we are actively advancing joint debugging with optical module customers. The company's proprietary direct coupling technology for lasers and waveguides enables the coupling distance between the light-emitting end face of the laser chip and the silicon waveguide to be reduced to less than 0.3 micrometers, effectively lowering coupling optical loss.